AMD Epyc ‘Milan-X’ Specifications Emerge in Leak

  • Whatsapp
AMD Epyc ‘Milan-X’ Specifications Emerge in Leak

AMD’s yet-unannounced Milan-X server chips have received yet another dose of leaked specifications courtesy of Leaker Executable Fix, including core counts, TDP, and base and boost clocks. Milan-X is expected to be a drop-in replacement for AMD’s server platform, with most of its performance and power improvements coming from the 3D V-Cache implementation that’s been developed in partnership with TSMC. The chips will join AMD’s currently-existing Epyc 7003 portfolio, will be based on the current Zen 3 design, and scale up to 64 cores. As this is a leak, it is best to take the news with a grain of salt until the official launch.

There are a total of four leaked CPUs. The top-of-the-line Epyc 7773X is reported to max out the Zen core count design with 64 cores and 128 threads, a 2.2 GHz base clock, 4.5 GHz boost, and a TDP of 280 W. The usage of 3D V-Cache is where things get interesting, with a grand total of 768 MB being quoted. The 768 MB results from the L3 cache that’s part of Zen 3’s CCD design (with each 8-core CCD being supported by 32 MB of L3, so, 256 MB in total) as well as the aforementioned stacked V-cache, with an additional 64 MB of L3 cache attached to each CCD (8 x 64 MB = 512 MB). 

Read More

Below the Epyc 7773X, AMD is reportedly also saddling three additional models with the 3D V-Cache solution, with the number of cores scaling throughout the stack. The Epyc 7573X should offer 32 Zen 3 cores with a 2.8 GHz base and 3.6 GHz boost clock with the same 280 W TDP; the Epyc 7473X cuts that number down further with only 24 cores, a 2.6 GHz base and 3.7 GHz boost clock at a 240 W TDP; and lastly, the Epyc 7373X, which offers 16 Zen 3 cores at a 3.05 GHz base and 3.8 GHz boost clocks, with the same 240 W TDP. According to the leak, all of AMD’s refreshed Epyc Milan-X CPUs will feature the same additional 512 MB 3D V-Cache.

Read Full Story

Related posts

Leave a Reply

Your email address will not be published. Required fields are marked *